PI Material
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DETAILS INTRODUCTION
Polyimide (abbreviated as PI) is one of the organic polymer materials with the best overall performance worldwide. It features outstanding properties including ultra-high temperature resistance above 400°C, superior electrical insulation, excellent flame retardancy and chemical resistance. Processable into various forms, it meets the stringent requirements of high-end manufacturing, aerospace, electronic information and other fields. Below are its core products and application scenarios, which precisely cater to demands across diverse industries and highlight core product values.
Our core products fall into four major categories with extensive applications:
PI films (including CPI and PSPI): Used for FPC substrates in consumer electronics, foldable screen cover plates and chip photolithography.
PI resins (including slurries and photoresists): Applied to semiconductor packaging, as well as bonding and protection of precision components.
PI fibers and composite materials: Suitable for aerospace structural parts and reinforcement of new energy equipment.
PI foams and custom molded products (such as PI sheets and rods): Ideal for extreme environments and precision manufacturing.
Our products fully cover four key sectors: electronic information, aerospace, new energy and precision manufacturing. We focus on the R&D and industrialization of polyimide, and support innovative development across various industries with our full range of high-performance products.
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