Kristen K245 Air-Cooled Ultra-Low Temperature Chiller: Precision Temperature Control Solution with -80℃ to 200℃ Wide Temperature Range for AI Advanced Packaging & Testing
In 2026, domestic production lines for advanced packaging are undergoing concentrated capacity expansion, while mass production of 2.5D, 3D stacked and HBM computing chips is accelerating. High-low temperature reliability testing of chips imposes multiple stringent requirements on temperature control equipment, including wide temperature range, high precision, compact footprint, low operating cost and intelligent control. Operating conditions vary drastically across different manufacturing plants, and the customizable capacity of equipment has now become a core evaluation criterion for semiconductor packaging and testing enterprises when purchasing temperature control equipment.
Core Highlights
- Accelerated Capacity Expansion of Advanced AI Packaging Production Lines,The K245 covers a temperature range from -80℃ to 200℃, delivering a temperature control accuracy of ±0.01K across the full temperature spectrum. It adapts to high-low temperature testing of various chips, with fully customizable complete units.
- A compact air-cooled structure comes as standard, eliminating the need for cooling water. A water-cooled version is also available on request, cutting factory infrastructure investment and operation & maintenance costs.
- Equipped with Siemens PID temperature regulation and standard Modbus-RTU communication, the communication protocols, operation programs and control logic can all be customized to achieve seamless connection with the host computers on production lines.
- It features a fully stainless steel sealed circulation loop and a dual-stage hermetic circulating pump for outstanding stability and durability. The liquid storage volume, pump flow rate and pipeline specifications support personalized adjustment, catering to 7×24-hour mass production and accelerating domestic substitution of temperature control equipment.
Upgraded Demand for AI Chip Packaging & Testing: Customizable Low-Temperature Refrigeration Equipment Becomes an Industry Must-Have
- 2026 will witness the mass launch of domestic production lines for 2.5D, 3D and HBM advanced packaging. AI chips and automotive-grade power chips impose drastically higher requirements on temperature control equipment in terms of precision, layout and automation. Diverse factory layouts and testing processes create distinct demand disparities; standardized imported equipment faces limitations in modification and carries exorbitant costs.
- The Kristen K245 semiconductor-specific air-cooled ultra-low-temperature chiller supports full-dimensional customization of both hardware and software, delivering a one-stop solution to all temperature control pain points in Chip Probing (CP) and Final Test (FT).
Core Performance & Customization Advantages of K245
1. Ultra-Wide Temperature Range & High-Precision Temperature Control, Customizable Temperature Zones and Power Ratings
The unit adopts bidirectional heating & cooling circulation, maintaining a constant temperature precision of ±0.01K throughout the full temperature range. Its liquid storage tank complies with DIN12876 standards, while stainless steel pipelines minimize heat loss and energy consumption.
The temperature ramp-up/ramp-down rates and high-low temperature power ranges can be adjusted on demand to match differentiated testing standards for memory chips, computing chips and laboratory R&D.
2. Compact Body with Multiple Heat Dissipation Solutions, Customizable Dimensions and Liquid Storage Volume
The base model adopts air cooling with no cooling water required. Its compact body facilitates convenient placement and transfer at workstations, lowering initial coolant filling costs.
Customization options include water-cooled heat dissipation, adjustable overall length/width/height of the unit, and variable liquid tank capacities, adapting to confined clean workshops or long-duration aging production lines.
3. High-Reliability Fluid System, Freely Selectable Pump and Pipeline Parameters
A dual-stage shaft-sealed circulating pump eliminates liquid leakage, with standard flow and pressure parameters meeting basic mass production requirements.
Users may upgrade to high-flow/high-pressure pumps, switch between Lemo connectors and threaded ports, and expand multiple circulation branches to support synchronous testing across multiple workstations.
4. Intelligent PID Control System, Customizable Communication Protocols and Operation Programs
Siemens PID constant temperature & constant pressure regulation is integrated, with standard RS485 Modbus-RTU communication compatible with a wide range of industrial buses.
Customizable services include MES docking protocols, bilingual Chinese-English operation interfaces, multi-segment temperature control programs and cloud-based remote monitoring functions.
Core Product Advantages
- Full-Dimensional Customization: Temperature zones, unit dimensions, heat dissipation modes, fluid systems and control systems can all be adjusted one-on-one to match personalized production line demands.
- Air-Cooled Design Eliminates Water Infrastructure: No cooling tower construction investment is needed, enabling rapid commissioning for small and medium-sized factories. Water-cooled variants are available for high-load production lines.
- Lower Consumable Costs: The base model features a small liquid storage volume, supporting three coolant media: pure water, ethylene glycol and fluorinated liquid, with adjustable tank capacities on demand.
- Local Full-Lifecycle Service: Self-owned production facility in Guangzhou, on-site commissioning for customized equipment, with after-sales response and maintenance costs over 35% lower than imported alternatives.
Application Scenarios (All Support Custom Modification)
- High-low temperature CP probing and FT finished product testing for HBM, 2.5D/3D advanced packaging chips
- Aging and reliability verification for AI computing GPUs and automotive power chips
- Low-temperature R&D in laboratories for new semiconductor materials and quantum chips
- Custom cleanroom and explosion-proof testing conditions for special-purpose chips
Industry Outlook
- Continuous capacity expansion of advanced packaging drives the localization of temperature control equipment. Standardized units fail to cover diversified testing scenarios, making customized models the mainstream market choice.
- The Kristen K245 delivers imported-grade temperature control precision paired with flexible customization capabilities. Matched with an air dryer offering a dew point of -72℃, it provides a full-process customized thermal management solution for chip testing, supporting the independent controllability of the semiconductor industrial chain.
Frequently Asked Questions
Q1: What core advantages does the K245 hold compared with imported low-temperature chillers?
A1: It delivers the same ±0.01K temperature control accuracy, features an air-cooled design with no infrastructure investment, and supports full-process customization of the complete unit. Local after-sales and maintenance costs are reduced by over 35%.
Q2: Can it adapt to mass-production HBM production lines and support customization?
A2: Fully compatible. Customization covers dimensions, communication programs and circulation flow rates based on central control systems and workstation layouts, enabling unified linkage control of multiple units.
Q3: Can the coolant type and liquid storage volume be customized?
A3: Three coolant media are supported: pure water, ethylene glycol and fluorinated liquid. The liquid storage volume and pipeline flow rate are fully adjustable on request.
Q4: Is customization available for small and medium-sized factories and niche R&D conditions?
A4: Yes. Lightweight small-scale customized solutions cater to small-batch R&D, allowing commissioning without large-scale factory renovation.
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